Jason Chang

ASE packages and tests chips designed by the world's leading semiconductor companies — Apple, NVIDIA, AMD, Qualcomm, and dozens of others — providing the critical back-end manufacturing step that turns raw silicon wafers into functional, package-ready chips. Advanced packaging has emerged as one of the most critical enablers of continued semiconductor performance improvement as traditional transistor scaling slows. Technologies like chiplets, 2.5D/3D packaging, fan-out wafer-level packaging, and system-in-package designs are essential for AI chips that combine multiple compute and memory dies in a single package. ASE's investments in advanced packaging position it as a key beneficiary of this secular trend. Chang's key decisions involve advanced packaging technology investment, capacity expansion for AI-related demand, competitive positioning against TSMC's expanding packaging ambitions, pricing strategy, and managing the balance between the growing advanced packaging business and the more commoditized traditional packaging operations.