Haviv Ilan

Born in Israel, Ilan holds degrees in electrical engineering and joined Texas Instruments in 1999. He rose through the company's high-volume analog and embedded processing divisions, becoming COO before being named CEO in April 2023, succeeding the long-tenured Rich Templeton. Texas Instruments under Ilan continues its distinctive strategy of owning and operating its own semiconductor fabrication facilities — a contrarian approach in an industry where most competitors have shifted to a fabless model relying on foundries like TSMC. TI is investing over $30 billion in new 300mm wafer fabrication capacity in Texas and Utah, supported by CHIPS Act incentives. This owned-manufacturing model gives TI control over its supply chain, lower long-term costs, and the ability to guarantee capacity for customers — a significant competitive advantage exposed during the 2020-2022 chip shortage. The company's product portfolio of over 80,000 analog and embedded chips is uniquely broad — TI parts are found in industrial equipment, automotive systems, personal electronics, communications infrastructure, and enterprise computing. Analog chips convert real-world signals (temperature, pressure, sound) into digital data, making them essential building blocks of virtually every electronic system. Unlike cutting-edge digital chips that follow Moore's Law, analog designs have long product lifecycles and stable, high margins. Ilan leads TI during a period of industry transition, as analog demand is reshaped by electric vehicles (which use 3-5x more analog content than combustion vehicles), industrial automation, renewable energy systems, and IoT deployment. His focus is on executing TI's massive capacity build-out while maintaining the capital allocation discipline — dividends and buybacks — that has made TI one of the most shareholder-friendly semiconductor companies globally.